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caution : observe precautions when handling because these devices are sensitive to electrostatic disc h arge bipolar analog integrated circuits ? pc2747tb, ? pc2748tb 3 v, super minimold silicon mmic amplifier for mobile communications document no. pu10201ej01v0ds (1st edition) (previ ous no. p13444ej3v0ds00) date published december 2002 cp(k ) the mark ? shows major revised points. description the ? pc2747tb, ? pc2748tb are silicon monolithic integrated circuits designed as amplifier for mobile communications. these ics are packaged in super minimold package which is smaller than conventional minimold. these ics are manufactured usin g our 20 ghz f t nesat lll silicon bipolar process. this process uses silicon nitride passivation film and gold electrodes. these materials can protect chip surface from external pollution and prevent corrosion/migration. thus, these ics have excellent p erformance, uniformity and reliability. features ? supply voltage : v cc = 2.7 to 3.3 v ? noise figure : ? ? pc2747tb ; nf = 3.3 db typ. @ f = 900 mhz ? ? pc2748tb ; nf = 2.8 db typ. @ f = 900 mhz ? power gain : ? ? pc2747tb ; g p = 12 db typ. @ f = 900 mhz ? ? pc2748tb ; g p = 19 db typ. @ f = 900 mhz ? o perating frequency : ? ? pc2747tb ; dc to 1.8 ghz ? ? pc2748tb ; 0.2 to 1.5 ghz ? isolation : ? ? pc2747tb ; isl = 40 db typ. @ f = 900 mhz ? ? pc2748tb ; isl = 40 db typ. @ f = 900 mhz ? high - density surfac e mounting : 6 - pin super minimold package (2.0 ? 1.25 ? 0.9 mm) application ? buffer amplifiers for mobile telephones, etc. (pdc800m, gsm) ordering information part number package marking supplying form ? pc2747tb - e3 6 - pin super minimold c1s ? embossed tape 8 mm wide ? 1, 2, 3 pins face the perforation side of the tape ? qty 3 kpcs/reel ? pc2748tb - e3 c1t remark to order evaluation samples, contact your nearby sales office. part number for sample order: ? pc2747tb - a , ? pc2748tb - a
data sheet pu10201ej01v0ds 2 ? pc2747tb, ? pc2748tb pin connections mar king is an example of ? pc2747tb pin no. pin name 1 input 2 gnd 3 gnd 4 output 5 gnd 6 v cc product line - up (t a = +25 ? cc = 3.0 v, z s = z l =50 ? part no. f u (ghz) p o (sat) (dbm) g p (db) nf (db) i cc (ma) package marking ? pc2745t 2.7 ? 1.0 12 6.0 7.5 6 - pin minimold c1q ? pc2745tb 6 - pin super minimold ? pc2746t 1.5 0 19 4.0 7.5 6 - pin minimold c1r ? pc2746tb 6 - pin super minimold ? pc2747t 1.8 ? 7.0 12 3.3 5.0 6 - pin minimold c1s ? pc2747tb 6 - pin super minimold ? pc2748t 1.5 ? 3. 5 19 2.8 6.0 6 - pin minimold c1t ? pc2748tb 6 - pin super minimold ? pc2749t 2.9 ? 6.0 16 4.0 6.0 6 - pin minimold c1u ? pc2749tb 6 - pin super minimold remark typical performance. please refer to electrical characteristics in detail. caution the pa ckage size distinguishes between minimold and super minimold. system application example example of digital celluler telephone
data sheet pu10201ej01v0ds 3 ? pc2747tb, ? pc2748tb pin explanation pin no. pin name applied voltage (v) pin voltage (v) note function and applications internal equ ivalent circuit 1 input ? 0.80 signal input pin. a internal matching circuit, configured with resistors, enables 50 ? connection over a wide band. t his pin must be coupled to signal source with capacitor for dc cut. the above diagram is for the ? pc2747t b. the resistor marked with an asterisk does not exist in the ? pc2748tb. 0.80 2 3 5 gnd 0 ? ground pin. this pin should be connected to system ground with minimum inductance. ground pattern on the board should be formed as wide as possible. all th e ground pins must be connected together with wide ground pattern to decrease impedance difference. 4 output ? 2.79 signal output pin. a internal matching circuit, configured with resistors, enables 50 ? connection over a wide band. this pin must be coup led to next stage with capacitor for dc cut. 2.72 6 v cc 2.7 to 3.3 ? power supply pin. this pin should be externally equipped with bypass capacity to minimize ground impedance. note pin voltage is measured at v cc = 3.0 v. above: ? pc274 7 tb, belo w: ? pc274 8 tb
data sheet pu10201ej01v0ds 4 ? pc2747tb, ? pc2748tb absolute maximum ratings parameter symbol conditions ratings unit supply voltage v cc t a = +25 ? c 4.0 v circuit current i cc t a = +25 ? c 15 ma power dissipation p d t a = +85 ? c note 270 mw operating ambient temperature t a ? 40 to +85 ? c st orage temperature t stg ? 55 to +150 ? c input power p in t a = +25 ? c 0 dbm note mounted on double - sided copper - clad 50 ? 50 ? 1.6 mm epoxy glass pwb recommended operating renge parameter symbol min. typ. max. unit supply voltage v cc 2.7 3.0 3.3 v el ectrical characteristics (t a = +25 ? cc = 3.0 v, z s = z l = 50 ? parameter symbol test conditions ? pc2747tb ? pc2748tb unit min. typ. max. min. typ. max. circuit current i cc no signal 3.8 5.0 7.0 4.5 6.0 8.0 ma power gain g p f = 900 mhz 9 12 14 16 19 21 db noise figure nf f = 900 mhz C 3.3 4.5 C 2.8 4.0 db upper limit operating frequency f u 3 db down below from gain at f = 0.9 ghz 1.5 1.8 C 1.2 1.5 C ghz lower limit operating frequency f l 3 db down below from gain at f = 0.9 ghz C C C C 0.2 0.4 ghz isolation isl f = 900 mhz 35 40 C 35 40 C db input return loss rl in f = 900 mhz 11 14 C 8.5 11.5 C db output return loss rl out f = 900 mhz 7 10 C 5.5 8.5 C db saturated output power p o (sat) f = 900 mhz , p in = C 8 dbm C 9.5 C 7.0 C C 6.0 C 3.5 C dbm
data sheet pu10201ej01v0ds 5 ? pc2747tb, ? pc2748tb standard characteristics for reference (t a = +25 ? s = z l =50 ? parameter symbol test conditions reference unit ? pc2747tb ? pc2748tb circuit c urrent i cc v cc = 1.8 v, no signal 3.0 3.5 ma power gain g p v cc = 1.8 v, f = 900 mhz 5.5 11.5 db noise f igure nf v cc = 1.8 v, f = 900 mhz 5. 2 4. 5 db upper l imit o perating f requency f u v cc = 1.8 v, 3 db down below from gain at f = 0.9 ghz 1.8 1. 5 ghz lower l imit o perating f requency f l v cc = 1.8 v, 3 db down below from ga in at f = 0.9 ghz ? 0.2 ghz isolation isl v cc = 1.8 v, f = 900 mhz 34 3 4 db input r eturn l oss rl in v cc = 1.8 v, f = 900 mhz 11 10 db output r eturn l oss rl out v cc = 1.8 v, f = 900 mhz 13 12 db saturated output power p o (sat) v cc = 1.8 v, f = 900 mhz , p i n = ? 8 dbm ? 13.7 ? 1 0.0 dbm 3rd o rder i ntermodulation d istortion im 3 v cc = 3.0 v, p out = ? 20 dbm, f 1 = 9 00 mhz, f 2 = 9 02 mhz ? 34 ? 38 d bc v cc = 1.8 v, p out = ? 20 dbm, f 1 = 9 00 mhz, f 2 = 9 02 mhz ? 20 ? 28
data sheet pu10201ej01v0ds 6 ? pc2747tb, ? pc2748tb test circuit example of application ci rcuit the application circuits and their parameters are for reference only and are not intended for use in actual design - ins. capacitors for v cc , input and output pins 1 000 pf capacitors are recommendable as bypass capacitor for v cc pin and coupling capacitors for input/output pins. bypass capacitor for v cc pin is intended to minimize v cc pins ground impedance . therefore, stable bias can be supplied against v cc fluctuation. coupling capacitors for input/output pins are intended to minimize rf serial impedance and cut dc. to get flat gain from 100 mhz up, 1 000 pf capacitors are assembled on the test circuit. [actually, 1 000 pf capacitors give flat gain at least 10 mhz. in the case of under 10 mhz operation, increase the value of coupling capacitor such as 2 200 pf. because the coupling capacitors are determined by the equation of f c = 1/(2 ? rc).]
data sheet pu10201ej01v0ds 7 ? pc2747tb, ? pc2748tb illustr ation of the test circuit assembled on evaluation board for more information on the use of this ic, refer to the following application note: usage and applications of 6 - pin mini - mold, 6 - pin super mini - mold silicon high - frequency wideband ampli fier mmic (p11976e) . component list value c 1 000 pf
data sheet pu10201ej01v0ds 8 ? pc2747tb, ? pc2748tb typical characteristics (t a = +25 ? ? ? ?
data sheet pu10201ej01v0ds 9 ? pc2747tb, ? pc2748tb ? ? ? remark the graphs indicate nominal characteristics.
data sheet pu10201ej01v0ds 10 ? pc2747tb, ? pc2748tb smith chart (t a = +25 ? cc = 3.0 v) ? ? ? s 11 - frequency s 22 - frequency
data sheet pu10201ej01v0ds 11 ? pc2747tb, ? pc2748tb s - parameters ? ? ?
data sheet pu10201ej01v0ds 12 ? pc2747tb, ? pc2748tb typical characteristics (t a = +25 ? ? ? ?
data sheet pu10201ej01v0ds 13 ? pc2747tb, ? pc2748tb ? ? ? remark the graphs indicate nominal characteristics.
data sheet pu10201ej01v0ds 14 ? pc2747tb, ? pc2748tb smith chart (t a = +25 ? cc = 3.0 v) ? ? ? s 11 - frequency s 22 - frequency
data sheet pu10201ej01v0ds 15 ? pc2747tb, ? pc2748tb s - parameters ? ? ?
data sheet pu10201ej01v0ds 16 ? pc2747tb, ? pc2748tb package dimensions 6 - pin super minimold (unit: mm)
data sheet pu10201ej01v0ds 17 ? pc2747tb, ? pc2748tb notes on correct use (1) observe precautions for handling because of electro - static sensitive devices. (2) form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). all the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) the bypass capacitor should be attached to v cc line . (4) the dc cut capacitor must be attached to input and output pin. recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recomme nded below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 ? c or below time at peak temperature : 10 seconds or less time at temperature of 220 ? c or higher : 60 seconds or less preheating time at 120 to 180 ? c : 120 ? 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below ir260 vps peak temperature (package surface temperature) : 215 ? c or below time at temperature of 200 ? c or higher : 25 to 40 seconds preheating time at 120 to 150 ? c : 30 to 60 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below vp215 wave solder ing peak temperature (molten solder temperature) : 260 ? c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 ? c or below maximum number of flow processes : 1 time maximum chlorine content of rosi n flux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (pin temperature) : 350 ? c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering methods together (except for partial heating).

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